Suchergebnisse

1. Introduction To Standards and Specifications -- 2. Understanding Blueprints -- 3. Processes And Tolerances -- 4. Artwork Inspection -- 5. Planning: Multilayer And Double Sided Printed Circuits -- 6. Planning Flex And Rigid-Flex Jobs -- 7. Aspects Of Quality Assurance -- A. MIL-STD-275E: Printed Wiring for Electronic Equipment -- B. IPC-D-300G: Printed Board Dimensions and Tolerances -- C. MIL-P-55110D: General Specification for Printed Wiring Boards -- D. IPC-A-600C: Guidelines for Acceptability of Printed Boards -- E. MIL-P-13949F: Plastic Sheet, Laminated, Metal Clad (For Printed Wiring Boards) -- F. MIL-STD-2118: Design Requirements for Flex and Rigid-Flex Printed Wiring for Electronic Equipment.

Section 1. Design and Manufacture of Printed Circuits -- 1. How Printed Circuit Boards Are Manufactured: Processes and Materials -- 2. Computer Aided Design and Design Automation -- 3. Digital Printed Circuit Design -- Section 2. Planning, Document Control, and Quality -- 4. Definitions -- 5. Planning -- 6. Quality Assurance Program -- 7. Quality Assurance Manual -- Section 3. Imaging and Artwork -- 8. Artwork Processing -- 9. Artwork Registration Systems for Dry Film Imaging -- 10. Dry Film Imaging -- 11. Screen Printing -- Section 4. N/C Processing -- 12. Numerical Controlled Drilling and Routing -- 12A. Drilling Procedures -- Section 5. Plating and Other Wet Processes -- 13. Metal Thickness Determination -- 14. Amperage Determination -- 15. The Electroless Copper Process 300 Detecting Problems -- 16. Pattern Plating: Copper, Tin-Lead, and Other Metals -- 17. Contact Finger Plating -- 18. Resist Stripping -- 19. Etching -- 20. Tin-Lead Fusing -- Section 6. Multilayer Printed Circuits -- 21. Multilayer Processing -- 22. Etchback and Smear Removal -- Section 7. Process Control -- 23. The Laboratory -- Section 8. The Marketing Program -- 24. Sales Tools -- 25. What Sales People Should Know About Printed Circuits -- Appendix A: Yield Tracking: A Tool for Productivity -- Appendix B: CAD: Swift, Precise, Infinitely Repeatable, but Never Creative -- Appendix C: Soldermask Over Bare Copper: Alternatives and Manufacturing Techniques -- Appendix D: Control and Operation of Printed Circuit Plating Baths with the Hull Cell -- Appendix E: Troubleshooting the IR Fusing Process -- Appendix F: Preserving Solderability with Solder Coatings -- Appendix G: Screen Printing Is the Answer -- Appendix H: Forecasting Waste Treatment Requirements -- Appendix I: Wave Soldering of Discrete Chip Components.